JPH0148657B2 - - Google Patents

Info

Publication number
JPH0148657B2
JPH0148657B2 JP58146810A JP14681083A JPH0148657B2 JP H0148657 B2 JPH0148657 B2 JP H0148657B2 JP 58146810 A JP58146810 A JP 58146810A JP 14681083 A JP14681083 A JP 14681083A JP H0148657 B2 JPH0148657 B2 JP H0148657B2
Authority
JP
Japan
Prior art keywords
metal
layer
copper
hydrogen
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58146810A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59106126A (ja
Inventor
Kenesu Ruisu Robaato
Kumaaru Rei Sadeiputa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS59106126A publication Critical patent/JPS59106126A/ja
Publication of JPH0148657B2 publication Critical patent/JPH0148657B2/ja
Granted legal-status Critical Current

Links

Classifications

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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
    • B23K35/383—Selection of media, e.g. special atmospheres for surrounding the working area mainly containing noble gases or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/087—Using a reactive gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12889—Au-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP58146810A 1982-12-02 1983-08-12 拡散防止処理方法 Granted JPS59106126A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/446,300 US4576659A (en) 1982-12-02 1982-12-02 Process for inhibiting metal migration during heat cycling of multilayer thin metal film structures
US446300 1982-12-02

Publications (2)

Publication Number Publication Date
JPS59106126A JPS59106126A (ja) 1984-06-19
JPH0148657B2 true JPH0148657B2 (en]) 1989-10-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP58146810A Granted JPS59106126A (ja) 1982-12-02 1983-08-12 拡散防止処理方法

Country Status (4)

Country Link
US (1) US4576659A (en])
EP (1) EP0110181B1 (en])
JP (1) JPS59106126A (en])
DE (1) DE3379323D1 (en])

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US4646958A (en) * 1985-10-31 1987-03-03 International Business Machines Corp. Fluxless soldering process using a silane atmosphere
DE3639021A1 (de) * 1986-11-14 1988-05-26 Philips Patentverwaltung Verfahren zum verloeten von keramischen bauteilen
JP2645014B2 (ja) * 1987-05-27 1997-08-25 株式会社日立製作所 ワイヤボンディング装置
US4860942A (en) * 1987-11-30 1989-08-29 Ceradyne, Inc. Method for soldering void-free joints
DE3811127A1 (de) * 1988-03-31 1989-10-12 Siemens Ag Diffusions-pressschweissen von blechpaketen aus nickel
US5145104A (en) * 1991-03-21 1992-09-08 International Business Machines Corporation Substrate soldering in a reducing atmosphere
FR2686212B1 (fr) * 1992-01-13 1994-03-11 Air Liquide Procede d'application de composition de soudure sur des broches de composants electroniques.
US5680092A (en) * 1993-11-11 1997-10-21 Matsushita Electric Industrial Co., Ltd. Chip resistor and method for producing the same
US6420205B1 (en) * 1999-03-24 2002-07-16 Kyocera Corporation Method for producing package for housing photosemiconductor element
CN101990458B (zh) 2008-04-03 2015-07-01 传统环境服务有限公司 处理硅酮废料的方法
JP7153565B2 (ja) * 2016-12-19 2022-10-14 田中貴金属工業株式会社 テープ状接点材及びその製造方法

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DE589502C (de) * 1929-09-29 1933-12-08 Arnold Redler Kastenfoerderer fuer Schuettgut
NL260635A (en]) * 1960-04-25
US3363308A (en) * 1962-07-30 1968-01-16 Texas Instruments Inc Diode contact arrangement
DE1589502C3 (de) * 1967-02-24 1974-01-24 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zur Herstellung einer Lotschicht und Anwendung des Verfahrens auf metallische Anschluß- und Halbleiter
US3964666A (en) * 1975-03-31 1976-06-22 Western Electric Company, Inc. Bonding contact members to circuit boards
JPS5311436A (en) * 1976-07-17 1978-02-01 Toyota Motor Corp Three-phase air mixing type automtovie air conditioner
JPS5325355A (en) * 1976-08-23 1978-03-09 Hitachi Ltd Production of semiconductor device
US4176443A (en) * 1977-03-08 1979-12-04 Sgs-Ates Componenti Elettronici S.P.A. Method of connecting semiconductor structure to external circuits
US4320412A (en) * 1977-06-23 1982-03-16 Western Electric Co., Inc. Composite material for mounting electronic devices
US4179534A (en) * 1978-05-24 1979-12-18 Bell Telephone Laboratories, Incorporated Gold-tin-gold ohmic contact to N-type group III-V semiconductors
JPS5850421B2 (ja) * 1978-07-19 1983-11-10 株式会社東芝 薄膜回路
JPS55138255A (en) * 1979-04-13 1980-10-28 Toshiba Corp Manufacture of semiconductor device
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GB2061155B (en) * 1979-10-11 1983-02-23 Secr Defence Pressure-bonding metal and/or ceramic members by using an interposed silver foil
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US4282043A (en) * 1980-02-25 1981-08-04 International Business Machines Corporation Process for reducing the interdiffusion of conductors and/or semiconductors in contact with each other
US4415375A (en) * 1982-06-10 1983-11-15 Mcdonnell Douglas Corporation Transient titanium alloys

Also Published As

Publication number Publication date
EP0110181B1 (en) 1989-03-08
EP0110181A2 (en) 1984-06-13
DE3379323D1 (en) 1989-04-13
EP0110181A3 (en) 1985-10-30
US4576659A (en) 1986-03-18
JPS59106126A (ja) 1984-06-19

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